Is there a user-friendly way to do this? I've tried playing with the "Drawing Tools" in Adobe Illustrator and was able to get very nice rounded corners, but there are so many options, so it's difficult to figure out what's happening. There are too many variables to just be able to copy and paste and get a result like the top of the image below.
A:
You can use the bevel and emboss effect (Effect > Distort & Transform > Bevel & Emboss)
Here's an example, I have used the image as a test, so you can ignore that.
The effect is in the top right, and can be used like this:
1. Field of the Invention
The present invention relates to a method of manufacturing a semiconductor device.
2. Description of the Related Art
In a semiconductor device manufacturing process, the surface of a semiconductor wafer is polished (planarized) to a target thickness using a chemical mechanical polishing (CMP) apparatus (see Patent Document 1, for example).
It is known that, to keep a CMP apparatus from deteriorating due to generation of heat or erosion of the pad when performing the CMP, a heat shield is installed above the pad. For example, a heat shield that is composed of a material containing aluminum is used (see Patent Document 2, for example).Bonding wires are commonly used in semiconductor device manufacturing. For example, bonding wires are used in wire bonding operations for the purpose of connecting bond pads of an integrated circuit (IC) die to conductive leads of a lead frame. In a typical wire bonding operation, an individual bonding wire is first formed by placing a bonding capillary between a bond pad and the integrated circuit lead. A length of the bonding wire is extended through the capillary to form a wire ball. The wire ball is then pressed against the bond pad with sufficient force to form a ball of material. A bonding device is used to provide sufficient force to be the ball of material while simultaneously supporting the integrated circuit lead. After the ball of material is formed, the capillary is moved to a position over the integrated circuit lead. The bonding device is then operated to clamp the bonding capillary down. The bonding capillary is caused to move downward, pulling the ball of material off of the bond pad and through the capillary to form the bonding wire. The wire is then allowed to cool. Typically, each bonding wire connects one ac619d1d87
Related links:
Comments